resin diamond grinding wheel, resin diamond polishing wheel

Brand: KO Type: Flat grinding wheel Material: Diamond Diameter: 6-900mm Line speed: 35~80m/s Grit: 40#~W3.5 (mesh) Application: tungsten carbide, pcd, pcbn, ceramic, cermet Binding Agent: Ceramic/ Vitrified Certification: ISO 9001:2000 MOQ: 5 pieces We are able to provide resin bond grinding wheels according to customers’ different requirements. The diameter range is 6-900mm; the thickness range is 0.07-520mm; the grit size range is 40/50-W3.5. We can also design and make nonstandard grinding wheels according to customers’ requirements. Features: The resin bond products have the features of good self-sharpening, sharp cutting, high efficiency, low roughness of work piece surface, few heat generating and without burning workpiece. They are suitable for high efficiency and precision grinding of most workpieces. Application: Resin bond diamond products: mainly used for machining tungsten carbide, ceramic materials, magnetic materials, silicon materials, thermal spraying alloy materials and so on.

E-mail: owen@kosuperhard.com